US Patent Issued to Guangzhou Kanglong Electronics on Feb. 17 for "Three-dimensional wired circuit board structure" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,218, issued on Feb. 17, was assigned to Guangzhou Kanglong Electronics Co. Ltd. (Guangzhou, China).

"Three-dimensional wired circuit board structure" was invented by Tielong Kang (Guangzhou, China) and Zhiming Liang (Guangzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is a three-dimensional wired circuit board structure, including a bottom board, the bottom board having a first slot and a first pin thereon; a function board, the function board having a second pin and a third pin thereon; and a bridge board, the bridge board having a second slot and a fourth pin thereon. The bottom of the function board is inserted ...