US Patent Issued to GUANGZHOU FANGBANG ELECTRONICS on Nov. 3 for "Metal foil, circuit board, and method for manufacturing circuit board" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,165, issued on Nov. 3, was assigned to GUANGZHOU FANGBANG ELECTRONICS Co. LTD (Guangzhou, China).

"Metal foil, circuit board, and method for manufacturing circuit board" was invented by Meijuan Zhang (Guangzhou, China) and Yuhua Zhu (Guangzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a metal foil, including a conductive layer and a bearing layer, the conductive layer and the bearing layer being stacked. The conductive layer is configured to manufacture a conductive line. When a circuit board is manufactured using the metal foil, the bearing layer is separated from the conductive layer by a first etching solution, and a roughn...