ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,501, issued on March 24, was assigned to GRAPHCORE Ltd. (Bristol, Great Britain).
"Heatsink for a memory and routing module" was invented by Stephen Bodiley (Bristol, Great Britain), David Japp (Bristol, Great Britain) and Stephen Felix (Bristol, Great Britain).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heatsink is provided for a memory and routing module with a lower and upper side, both sides having multiple semiconductor chips attached. The lower side of the module has a connection component attached for connection to a motherboard. The heatsink includes a module receiving region configured to receive a lower side of the module, including a...