US Patent Issued to GRAND PROCESS TECHNOLOGY on Oct. 27 for "Wafer processing method" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,773,723, issued on Oct. 27, was assigned to GRAND PROCESS TECHNOLOGY Corp. (Hsinchu City, Taiwan).

"Wafer processing method" was invented by Li-tso Huang (Hsinchu City, Taiwan), Hsiu-kai Chang (Hsinchu City, Taiwan), Chin-yuan Wu (Hsinchu City, Taiwan) and Ming-che Hsu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing method is provided. The method includes a device providing step, a first lifting step, a wafer placing step, a second lifting step, a soaking step, and a third lifting steps, and a spinning cleaning step. The device providing step includes providing a multifunctional single wafer immersion and spin cle...