US Patent Issued to Google on March 3 for "Pin fin placement assembly for forming temperature control element utilized in device die packages" (California Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,821, issued on March 3, was assigned to Google LLC (Mountain View, Calif.).

"Pin fin placement assembly for forming temperature control element utilized in device die packages" was invented by Yingshi Tang (Danville, Calif.), Yingying Wang (Sunnyvale, Calif.), Padam Jain (San Jose, Calif.), Emad Samadiani (Cypress, Calif.), Sudharshan Sugavanesh Udhayakumar (San Jose, Calif.) and Madhusudan K. Iyengar (Foster City, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pin fin placement assembly utilized to form pin fins in a thermal dissipating feature is provided. The pin fin placement assembly may place the pin fins on an IC die disposed in the ...