US Patent Issued to GM GLOBAL TECHNOLOGY OPERATIONS on July 21 for "Power module including semiconductor devices" (Michigan, Connecticut Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,306, issued on July 21, was assigned to GM GLOBAL TECHNOLOGY OPERATIONS LLC (Detroit).

"Power module including semiconductor devices" was invented by Yilun Luo (Ann Arbor, Mich.), Chandra S. Namuduri (Troy, Mich.) and Pengwei Li (Willington, Conn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power module may include a dielectric substrate and a plurality of conductors disposed on the dielectric substrate. The power module further may include a plurality of high-side semiconductor devices. A high-side conduction path length between a first terminal of each of the plurality of high-side semiconductor devices and a plurality of terminal ends of the...