US Patent Issued to GLOBALWAFERS on July 21 for "Wafer carrier" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,422, issued on July 21, was assigned to GLOBALWAFERS Co. LTD. (Hsinchu City, Taiwan).

"Wafer carrier" was invented by Chih-Yuan Chuang (Hsinchu City, Taiwan), Jui-Pin Chen (Hsinchu City, Taiwan) and Jia-Zhe Liu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer carrier with a bottom for connecting to a shaft includes a disc body and at least one heat insulator. The disc body has an accommodating groove for accommodating a wafer, and the disc body has a first surface and a second surface opposing each other. A groove bottom of the accommodating groove has the first surface. The at least one heat insulator is disposed on eith...