US Patent Issued to GlobalWafers on Aug. 11 for "Wafer grinding parameter optimization method and electronic device" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,062, issued on Aug. 11, was assigned to GlobalWafers Co. Ltd. (Hsinchu, Taiwan).

"Wafer grinding parameter optimization method and electronic device" was invented by Chih-Chun Cheng (Hsinchu, Taiwan), Wen-Nan Cheng (Hsinchu, Taiwan), Meng-Bi Lin (Hsinchu, Taiwan), Chi-Feng Li (Hsinchu, Taiwan), Tzu-Fan Chiang (Hsinchu, Taiwan), Wei-Jen Chen (Hsinchu, Taiwan), Chien Hung Chen (Hsinchu, Taiwan), Hsiu Chi Liang (Hsinchu, Taiwan) and Ying-Ru Shih (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer grinding parameter optimization method and an electronic device are provided. The method includes the following. A natural frequency of a ...