US Patent Issued to GlobalWafers on April 21 for "Methods for controlling wafer breakage during ingot slicing operations" (Taiwanese, American Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,863, issued on April 21, was assigned to GlobalWafers Co. Ltd. (Hsinchu, Taiwan).

"Methods for controlling wafer breakage during ingot slicing operations" was invented by Jung-Chiang Liao (Zhubei City, Taiwan), Yi-Chun Chou (Zhubei City, Taiwan), Liang-Chin Chen (Zhubei City, Taiwan), Chin-Yu Chang (Hsinchu City, Taiwan), Ming-Tao Chia (Zhubei City, Taiwan) and Peter D. Albrecht (O'Fallon, Mo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of slicing wafers from a monocrystalline semiconductor ingot includes attaching a circumferential edge of the ingot to a bond beam and positioning sacrificial disks adjacent longitudinal end faces of the...