US Patent Issued to GlobalFoundries U.S. on May 19 for "Three-dimensional integrated circuit with top chip including schottky diode body contact" (Singaporean, Indian Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,584, issued on May 19, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.).

"Three-dimensional integrated circuit with top chip including schottky diode body contact" was invented by Anupam Dutta (Kolkata, India), Satyasuresh Vvss Choppalli (Bangalore, India), Rui Tze Toh (Singapore) and Mei Hui June Goh (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed structures and methods include a top chip flipped relative to a bottom chip and bonded thereto. On the top chip, dielectric material layers separate a transistor from the bottom chip. The transistor includes source and drain regions, a body region on a channel region between the ...