ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,735, issued on April 14, was assigned to GLOBALFOUNDRIES U.S. Inc. (Malta, N.Y.).
"Device with airgap structure" was invented by Uppili S. Raghunathan (Essex Junction, Vt.), Vibhor Jain (Williston, Vt.), Siva P. Adusumilli (South Burlington, Vt.), Yves T. Ngu (Williston, Vt.), Johnatan A. Kantarovsky (South Burlington, Vt.) and Sebastian T. Ventrone (South Burlington, Vt.).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to semiconductor structures and, more particularly, to devices with airgap structures and methods of manufacture. The structure includes: a semiconductor substrate with a trap-rich region; one or more ai...