US Patent Issued to GlobalFoundries Singapore on March 17 for "Electronic fuses with an airgap under the fuse link" (Singaporean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,942, issued on March 17, was assigned to GlobalFoundries Singapore Pte. Ltd. (Singapore).

"Electronic fuses with an airgap under the fuse link" was invented by Shyue Seng Tan (Singapore), Zar Lwin Zin (Singapore) and Eng Huat Toh (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Structures for an electronic fuse and methods of forming an electronic fuse. The structure comprises an electronic fuse including a first terminal, a second terminal, and a fuse link extending from the first terminal to the second terminal. The first terminal, the second terminal, and the fuse link each include a semiconductor layer and a silicide layer. The silicid...