US Patent Issued to GLOBALFOUNDRIES Singapore on Feb. 24 for "Contact via structures of semiconductor devices" (Singaporean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,029, issued on Feb. 24, was assigned to GLOBALFOUNDRIES Singapore Pte. Ltd. (Singapore).

"Contact via structures of semiconductor devices" was invented by Yung Fu Chong (Singapore), Rui Tze Toh (Singapore) and Fangyue Liu (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "The embodiments herein relate to contact via structures of semiconductor devices and methods of forming the same. A semiconductor device is provided. The semiconductor device includes a substrate, a conductive feature, and a contact via structure. The conductive feature is over the substrate. The contact via structure is electrically coupled to the conductive feature and inc...