US Patent Issued to Gigaphoton on May 19 for "Laser processing method and circuit board manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,083, issued on May 19, was assigned to Gigaphoton Inc. (Tochigi, Japan).

"Laser processing method and circuit board manufacturing method" was invented by Akira Suwa (Oyama, Japan), Kouji Kakizaki (Oyama, Japan), Masakazu Kobayashi (Oyama, Japan), Junichi Fujimoto (Oyama, Japan) and Yasufumi Kawasuji (Oyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laser processing method according to a viewpoint of the present disclosure includes radiating ultraviolet pulse laser light onto a workpiece having a stacked structure in which a conductor layer, an insulating layer, and a sacrificial layer are stacked on each other in the presented order, the...