ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,785,187, issued on Nov. 3, was assigned to Genesee Valley Innovations LLC (Santa Clara, Calif.).
"Filament sealing layer for biodegradable electrochemical device and methods thereof" was invented by Naveen Chopra (Oakville, Canada), Gregory McGuire (Oakville, Canada), Edward G. Zwartz (Mississauga, Canada) and Nan-Xing Hu (Oakville, Canada).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electrochemical device is disclosed, including a first substrate layer. The electrochemical device also includes an anode disposed upon the first substrate layer. The device also includes a second substrate layer. The electrochemical device also includes a cathode dispo...