US Patent Issued to Gebr. Schmid on Sept. 8 for "Method of producing printed circuit boards and printed circuit boards produced in accordance with the method" (German Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,108, issued on Sept. 8, was assigned to Gebr. Schmid GmbH (Freudenstadt, Germany).

"Method of producing printed circuit boards and printed circuit boards produced in accordance with the method" was invented by Christian Schmid (Freudenstadt, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of producing a multilayer printed circuit board includes a metallic conductor structure including providing a base substrate including a film or plate and having first and second substrate sides, which base substrate at least partly consists of an electrically non-conductive organic polymer material and wherein the first substrate side is covered wi...