US Patent Issued to GE Infrastructure Technology on Sept. 15 for "Metal coupon with porous stress-relief section and component with same" (South Carolina, New York Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,735,986, issued on Sept. 15, was assigned to GE Infrastructure Technology LLC (Greenville, S.C.).

"Metal coupon with porous stress-relief section and component with same" was invented by Evan John Dozier (Greenville, S.C.), Nathan Nicholas Ostrout (Greenville, S.C.), Jacob Andrew Salm (Simpsonville, S.C.), Mark Lawrence Hunt (Greenville, S.C.), Stanley Frank Simpson (Greenville, S.C.) and James Warren Pemrick (Troy, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component including a body, and an additively manufactured (AM) metal coupon including a first section and a stress-relief section, is disclosed. The stress-relief section includes a por...