US Patent Issued to GE Infrastructure Technology on March 17 for "Porous metal coupon with thermal transfer structure for component and related component" (South Carolina Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,614, issued on March 17, was assigned to GE Infrastructure Technology LLC (Greenville, S.C.).

"Porous metal coupon with thermal transfer structure for component and related component" was invented by Mark Lawrence Hunt (Greenville, S.C.), Nathan Nicholas Ostrout (Greenville, S.C.) and Jacob Andrew Salm (Simpsonville, S.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component includes a body and an additively manufactured (AM) metal coupon that includes a primary member having a member porosity between 2% to 50% open space volume to total volume of the primary member. The primary member includes a first portion and a second portion distanced fr...