US Patent Issued to FURUKAWA ELECTRIC on Sept. 29 for "Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,310, issued on Sept. 29, was assigned to FURUKAWA ELECTRIC Co. LTD. (Tokyo).

"Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same" was invented by Minoru Morita (Tokyo), Yota Otani (Tokyo) and Hiromitsu Maruyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A dicing die attach film containing a dicing film and a die attach film stacked on the dicing film, wherein the die attach film contains an organic solvent having a boiling point of 100deg C. or more and less than 150deg C. and a vapor pressure of 50 mmHg or less, and wherein an amount of the organic solvent in the die attac...