US Patent Issued to FUKUDA METAL FOIL & POWDER on Sept. 8 for "Surface-treated copper foil, and copper-clad laminate and printed wiring board including the surface-treated copper foil" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,451, issued on Sept. 8, was assigned to FUKUDA METAL FOIL & POWDER Co. LTD. (Kyoto, Japan).

"Surface-treated copper foil, and copper-clad laminate and printed wiring board including the surface-treated copper foil" was invented by Takeshi Okamoto (Kyoto, Japan) and Kenta Miyamoto (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A surface-treated copper foil includes a roughening treatment layer on at least one surface of an untreated copper foil, a heat-resistant treatment layer on the roughening treatment layer, and a chromate treatment layer on the heat-resistant treatment layer. The roughening treatment layer is formed of copper parti...