ALEXANDRIA, Va., May 26 -- United States Patent no. 12,637,635, issued on May 26, was assigned to FUJIMI Inc. (Kiyosu, Japan).
"Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate" was invented by Tsutomu Yoshino (Aichi, Japan), Shogo Onishi (Aichi, Japan) and Yasuto Ishida (Aichi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "To provide a means capable of sufficiently removing organic residues present on the surface of a polishing object after polishing containing silicon oxide or polysilicon.A surface treatment composition contains a polymer having a constituent unit represented by Formula (1) b...