ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,697, issued on July 14, was assigned to FUJIKURA PRINTED CIRCUITS LTD. (Tokyo).
"Method for manufacturing wiring board" was invented by Daisuke Arai (Chiba, Japan) and Shigeki Otsuka (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a wiring board includes covering a part of a wiring disposed on a base material for the wiring board by disposing a separation layer on the base material; covering the wiring and the separation layer by disposing a cover lay including a removal portion on the base material; and removing the removal portion of the cover lay laminated on the separation layer and exposing a part of the wiring f...