ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,139, issued on March 24, was assigned to Fujikura Ltd. (Tokyo).
"Wiring board and method for manufacturing wiring board" was invented by Kazutoshi Koshimizu (Chiba, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes a first substrate, a second substrate composed of a material different from a material of the first substrate, a wiring supported by the first substrate, and a terminal supported by the second substrate and connected to the wiring. The first and second substrates are disposed on a same side with respect to the wiring. In a plan view, the first substrate overlaps the wiring but not the terminal. In the plan view...