ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,424, issued on Sept. 8, was assigned to FUJIFILM Corp. (Tokyo).
"Cleaning liquid and method for cleaning semiconductor substrate" was invented by Tetsuya Kamimura (Haibara-gun, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a cleaning liquid for a semiconductor substrate that has been subjected to CMP, in which the cleaning liquid has an excellent selectivity for RuO2 removing performance; and a method for cleaning a semiconductor substrate that has been subjected to CMP. The cleaning liquid of an embodiment of the present invention is a cleaning liquid for a semiconductor substrate that has been subjected to a c...