US Patent Issued to FUJIFILM on Feb. 24 for "Method of manufacturing chemical fluid for manufacturing electronic material, pattern forming method, method of manufacturing semiconductor device, chemical fluid for manufacturing electronic material, container, and quality inspection method" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,560,861, issued on Feb. 24, was assigned to FUJIFILM Corp. (Tokyo).

"Method of manufacturing chemical fluid for manufacturing electronic material, pattern forming method, method of manufacturing semiconductor device, chemical fluid for manufacturing electronic material, container, and quality inspection method" was invented by Tetsuya Shimizu (Shizuoka, Japan), Tsukasa Yamanaka (Shizuoka, Japan) and Yukihisa Kawada (Shizuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A container for storing a chemical fluid for manufacturing an electronic material, in which after an inspection solution charges the container and stored at 25deg C. for 30 days,...