US Patent Issued to FUJIFILM on April 21 for "Material for acoustic matching layer, acoustic matching sheet, acoustic wave probe, ultrasound probe, acoustic wave measurement apparatus, ultrasound diagnostic apparatus, and method for manufacturing acoustic wave probe" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,142, issued on April 21, was assigned to FUJIFILM Corp. (Tokyo).

"Material for acoustic matching layer, acoustic matching sheet, acoustic wave probe, ultrasound probe, acoustic wave measurement apparatus, ultrasound diagnostic apparatus, and method for manufacturing acoustic wave probe" was invented by Kazuhiro Hamada (Kanagawa, Japan), Yoshihiro Nakai (Kanagawa, Japan) and Daisuke Hayashi (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A material for an acoustic matching layer contains the following components (A), (B), and (C): (A) an epoxy resin; (B) a curing agent; and (C) surface-treated tungsten carbide particles subjected to ...