US Patent Issued to Fujifilm Electronic Materials U.S.A. on May 12 for "Method of reducing defects on polished wafers" (Arizona Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,317, issued on May 12, was assigned to Fujifilm Electronic Materials U.S.A. Inc. (North Kingstown, R.I.).

"Method of reducing defects on polished wafers" was invented by Bin Hu (Chandler, Ariz.), Binh Duong (Gilbert, Ariz.), Carl Ballesteros (San Tan Valley, Ariz.), Yannan Liang (Gilbert, Ariz.) and Hyosang Lee (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure relates to a method that includes applying a polishing composition to a surface of a substrate; bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate to create a polished substrate; treating the polished subst...