US Patent Issued to Fujian Jinhua Integrated Circuit on July 14 for "Contact pad structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,114, issued on July 14, was assigned to Fujian Jinhua Integrated Circuit Co. Ltd. (Quanzhou City, China).

"Contact pad structure and manufacturing method thereof" was invented by Janbo Zhang (Quanzhou City, China) and Li-Wei Feng (Quanzhou City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A contact pad structure and a manufacturing method thereof are disclosed in the present invention. The contact pad structure includes a substrate, a first dielectric layer, a second dielectric layer, first contact pads, an etching stop layer, a first void, and a second void. The first contact pads are disposed on a first region of the substrate. The first ...