ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,494, issued on Sept. 8, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Semiconductor element bonding portion and semiconductor device" was invented by Masaaki Tachioka (Matsumoto-city, Japan) and Takashi Saito (Matsumoto-city, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to provide highly reliable semiconductor element bonding portion and semiconductor device that have high heat resistance and improved adhesion between a bonding material and a sealing resin. Provided is a semiconductor element bonding portion in which the semiconductor element 11 and an electrically conductive plate 123a are bonded to each other by a...