US Patent Issued to FUJI ELECTRIC on Sept. 1 for "Bonding tool, semiconductor device manufacturing method, and semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,501, issued on Sept. 1, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Bonding tool, semiconductor device manufacturing method, and semiconductor device" was invented by Hiroaki Hokazono (Hachioji-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding tool for bonding two conductive plates in contact with each other by pressing the bonding tool against the two conductive plates while vibrating a bonding end portion thereof in a direction parallel to the conductive plates. The bonding end portion of the bonding tool includes a bonding base having an end surface, the end surface having a protrusion area that has two sides fac...