ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,929, issued on Oct. 27, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor device" was invented by Shinichi Masuda (Matsumoto-city, Japan) and Takuya Yamamoto (Matsumoto-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes first and second semiconductor chips disposed away from each other by a chip distance on an insulated circuit board. A lower limit of the chip distance between the first and second semiconductor chips is set based on a first distance where a minimum thermal resistance of a heat dissipation path from a heat generation point on the front surface of the first semiconductor c...