US Patent Issued to FUJI ELECTRIC on Nov. 3 for "Semiconductor module and semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,848, issued on Nov. 3, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module and semiconductor device" was invented by Naoki Hayashi (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes: a laminated substrate configured by laminating an insulating plate, a heat dissipation plate disposed on a lower surface of the insulating plate, and a circuit plate disposed on an upper surface of the insulating plate; a semiconductor element disposed on an upper surface of the circuit plate; a case that surrounds the laminated substrate and a space housing the semiconductor element; a sealing resi...