ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,418, issued on May 12, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Solder material for semiconductor device" was invented by Hirohiko Watanabe (Hachioji, Japan), Shunsuke Saito (Hachioji, Japan), Yoshitaka Nishimura (Azumino, Japan) and Fumihiko Momose (Higashi-chikuma-gun, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A lead-free solder has a heat resistance temperature which is high and a thermal conductive property which is not changed in a high temperature range. A semiconductor device includes a solder material containing more than 5.0% by mass and 10.0% by mass or less of Sb and 2.0 to 4.0% by mass of Ag, an element select...