US Patent Issued to FUJI ELECTRIC on Feb. 24 for "Semiconductor apparatus and method of manufacturing semiconductor apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,114, issued on Feb. 24, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor apparatus and method of manufacturing semiconductor apparatus" was invented by Naoki Saegusa (Matsumoto-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin enclosure includes: an inner wall portion from a wall surface defining the space to a side surface of the lead terminal close to the space; and a covering portion that covers at least a part of a top surface of a first portion of the lead terminal."

The patent was filed on Feb. 25, 2022, under Application No. 17/681,390.

*For further information, including images, charts and tables, p...