ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,018, issued on Aug. 11, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).
"Method of manufacturing semiconductor device" was invented by Takashi Saito (Matsumoto-city, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor module includes: placing, on a lower hot plate, an insulating wiring substrate having an electrically-conductive pattern formed on an insulating substrate; placing sintered materials on the electrically-conductive pattern; placing semiconductor chips on the sintered materials; placing a cushioning material over the semiconductor chips; placing an upper hot plate on the cushioning mat...