US Patent Issued to Frontgrade Technologies on Aug. 11 for "Ball grid array assembly using a solder paste mix and method of using a solder paste dip" (Colorado Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,987, issued on Aug. 11, was assigned to Frontgrade Technologies Inc. (Colorado Springs, Colo.).

"Ball grid array assembly using a solder paste mix and method of using a solder paste dip" was invented by Scott Popelar (Colorado Springs, Colo.), Julie Hook (Colorado Springs, Colo.) and Sean Brinlee (Woodland Park, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a ball grid array (BGA) assembly is disclosed. An example method may include coating at least a portion of each solder ball of a BGA in a solder paste mix. The method may further include mounting the BGA onto a secondary board to form the BGA assembly, wherein mo...