US Patent Issued to Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung on Aug. 25 for "Method for laser-based singulating of microchips on structured substrates" (German Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,078, issued on Aug. 25, was assigned to Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V. (Munich).

"Method for laser-based singulating of microchips on structured substrates" was invented by Sergiu Langa (Dresden, Germany), Thomas Ludewig (Dresden, Germany), Andreas Mrosk (Dresden, Germany) and Andreas Gang (Moritzburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "The subject-matter of this disclosure is a method for singulating microchips. The method includes providing a single-layer or multi-layer substrate. The method further includes laser-based creating microcracks in the substrate using a laser beam that penetrate...