US Patent Issued to Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung on Nov. 3 for "Method for manufacturing a cap substrate, method for manufacturing a hermetically housed optoelectronic device, and hermetically housed optoelectronic device" (German Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,509, issued on Nov. 3, was assigned to Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V. (Munich).

"Method for manufacturing a cap substrate, method for manufacturing a hermetically housed optoelectronic device, and hermetically housed optoelectronic device" was invented by Wolfgang Reinert (Itzehoe, Germany), Vanessa Stenchly (Itzehoe, Germany), Hans-Joachim Quenzer (Itzehoe, Germany) and Dirk Kaehler (Itzehoe, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes the steps of: providing a mold substrate and a cover substrate that are bonded to each other, wherein a surface region of the mold substrate and/or o...