ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,094, issued on March 3, was assigned to FOXSEMICON INTEGRATED TECHNOLOGY INC. (Miao-Li Hsien, Taiwan).

"Device for measuring physical property of wafer" was invented by Si-Yu Wen (Miaoli Hsien, Taiwan), Chun-Kai Huang (Miaoli Hsien, Taiwan) and Chun-Chung Chen (Miaoli Hsien, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device is provided. The device is arranged in a wafer box and is configured to simulate to measure physical properties of a surface of a wafer in the wafer box during an air filling and exchanging operation on the wafer box when the wafer box is closed. The device includes one or more simulating members and one or more sens...