US Patent Issued to Foxconn Interconnect Technology on July 14 for "Connecting system and electrical connector for chip module" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,307, issued on July 14, was assigned to Foxconn Interconnect Technology Ltd. (Grand Cayman, Cayman Islands).

"Connecting system and electrical connector for chip module" was invented by Chia-Yen Lee (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A connecting system and an electrical connector for a chip module are provided. The connecting system includes the chip module and the electrical connector. The chip module includes a chip substrate. The chip substrate has a plurality of first conductive pads arranged in a matrix manner. The electrical connector includes a first output end and a second output end. The first output en...