ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,178, issued on March 31, was assigned to FORTEMEDIA INC. (Alviso, Calif.).

"Micro-electro-mechanical system microphone package" was invented by Yen-Son Paul Huang (Santa Clara, Calif.), Iou-Din Jean Chen (Fremont, Calif.), Shih-Chung Wang (Hsinchu City, Taiwan) and Yung-Wei Chen (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A micro-electro-mechanical system (MEMS) microphone package is provided. The MEMS microphone package includes a first micro-electro-mechanical system (MEMS) sensor die, an integrated circuit (IC) die and a first conductive lid. The first micro-electro-mechanical system (MEMS) sensor die has a first surface ...