ALEXANDRIA, Va., May 5 -- United States Patent no. D1,125,299, issued on May 5, was assigned to Formlabs Inc. (Somerville, Mass.).
"Build platform" was invented by Daniel Chu (Lexington, Mass.), Danlei Huang (Somerville, Mass.) and Ryan Smith (Somerville, Mass.).
The patent was filed on April 5, 2024, under Application No. D/936,062.
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