ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,800, issued on Oct. 6, was assigned to FORCE MOS TECHNOLOGY Co. LTD. (New Taipei City, Taiwan).
"Method of making a multi-chip package device" was invented by Yuan-Shun Chang (Hsinchu, Taiwan), Kao-Way Tu (Hsinchu, Taiwan), Ping-Chia Chung (New Taipei City, Taiwan) and Yu-Chan Tsai (New Taipei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for making a multi-chip package device includes: providing a lead frame unit having a plurality of lead frames, each of the lead frames having a base seat that has an upper surface and a bottom surface, and a plurality of leads; electrically attaching a transistor chip onto the base seat, the ...