US Patent Issued to FASFORD TECHNOLOGY on Nov. 3 for "Dipping apparatus, die bonding apparatus, and manufacturing method for semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,837, issued on Nov. 3, was assigned to FASFORD TECHNOLOGY Co. LTD. (Minami-Alps, Japan).

"Dipping apparatus, die bonding apparatus, and manufacturing method for semiconductor device" was invented by Geonju Lee (Minami-Alps, Japan), Kazunobu Sakai (Minami-Alps, Japan) and Takahiro Kato (Minami-Alps, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A dipping apparatus includes a squeegee device and a plate for forming a flux film out of flux. A surface of the plate has a rough surface with a nano-level arithmetically average roughness. The dipping apparatus is configured in such a way that the squeegee device and the plate are moved relatively to e...