US Patent Issued to Fasford Technology on March 24 for "Die bonding apparatus and manufacturing method for semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,457, issued on March 24, was assigned to Fasford Technology Co. Ltd. (Minami-Alps City, Japan).

"Die bonding apparatus and manufacturing method for semiconductor device" was invented by Akira Saito (Minami-Alps, Japan), Takumi Sassa (Minami-Alps, Japan) and Yuki Nakui (Minami-Alps, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die bonding apparatus includes a push-up unit, a head having a collet that sucks a die, and a control device. The control device is configured to suck a dicing tape using a dome plate; land the collet onto the die using the head; suck the die using the collet; lift plural blocks from the dome plate; stop the outermos...