US Patent Issued to FANUC on Aug. 4 for "Device and method for correcting thermal displacement using generated data collection plan" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,699,385, issued on Aug. 4, was assigned to FANUC Corp. (Yamanashi, Japan).

"Device and method for correcting thermal displacement using generated data collection plan" was invented by Mitsunori Watanabe (Yamanashi, Japan) and Keita Hada (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This data collection plan generating device generates a data collection plan including a combination of operating conditions for use when data are being acquired from an industrial machine that is operating. The data collection plan generating device: sets the specification of the industrial machine; extracts a constraining condition relating to an operation...