US Patent Issued to EVATEC on April 7 for "Vacuum layer deposition apparatus and method of depositing a layer on a substrate, especially on a substrate comprising indentations in the surface to be coated" (Liechtensteiner Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,550, issued on April 7, was assigned to EVATEC AG (Trubbach, Switzerland).

"Vacuum layer deposition apparatus and method of depositing a layer on a substrate, especially on a substrate comprising indentations in the surface to be coated" was invented by Jurgen Weichart (Balzers, Liechtenstein).

According to the abstract* released by the U.S. Patent & Trademark Office: "A vacuum layer deposition apparatus includes a vacuum coating chamber with an inner space; a material source to generate electrically positively charged particles of a material to be deposited on a substrate in said inner space; a substrate holder with an extended metal or dielectric material surface exposed to sai...