US Patent Issued to ESE on Oct. 6 for "Sealed squeegee for supplying solder paste with uniform density" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,752,358, issued on Oct. 6, was assigned to ESE Co. LTD. (Pyeongtaek-si, South Korea).

"Sealed squeegee for supplying solder paste with uniform density" was invented by Hyung Rae Ko (Incheon, South Korea) and Cheol Hong Myung (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sealed squeegee for supplying a solder paste with a uniform density is disclosed. In the process of pressurizing and mixing the solder paste contained in a pressurization chamber by a pumping pad that contracts and expands according to injection and discharge of compressed air, the sealed squeegee minimizes a pressure change within the pressurization chamber due t...