ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,706, issued on Nov. 3, was assigned to Entegris Inc. (Billerica, Mass.).
"Electrostatic chuck with reduced charge injection into dielectric layer" was invented by Jakub Rybczynski (Arlington, Mass.) and Steven Donnell (Burlington, Mass.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electrostatic chuck device having reduced charge injection may include a dielectric layer, a bonding layer, an electrode layer, and an isolator layer, the bonding layer being located between the dielectric layer and the electrode layer, the electrode layer being located between the bonding layer and the isolator layer, and the electrode layer does not directly contact ...