US Patent Issued to ENPULSE on June 2 for "Polishing pad, method for manufacturing the same, and method for manufacturing semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,643,192, issued on June 2, was assigned to ENPULSE Co. LTD. (Chungcheongnam-do, South Korea).

"Polishing pad, method for manufacturing the same, and method for manufacturing semiconductor device using the same" was invented by Eun Sun Joeng (Gyeonggi-do, South Korea), Jong Wook Yun (Seoul, South Korea), Jang Won Seo (Seoul, South Korea) and Su Young Moon (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing pad includes a polishing layer, wherein the polishing layer includes zinc (Zn), and a concentration of the zinc (Zn) is 0.5 ppm to 40 ppm parts by weight based on the total weight of the polishing layer. In an exemplary embodi...